IEEE EMC Distinguished Lecturer: Opportunities, Challenges and Implementations of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Room: Level C, Bldg: New Residence HallCo-sponsored by: STARaCom Research Network Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly... Read more