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IEEE EMC Distinguished Lecturer: Opportunities, Challenges and Implementations of Silicon Integration and Packaging in mmWave Radar and Communication Applications
October 9, 2019 @ 1:30 pm - 2:45 pm EDT
Co-sponsored by: STARaCom Research Network
Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. We will then introduce a software-defined phased array radio based on the 28-GHz hardware. The highly re-configurable phased array radio features beam shaping/steering control as well as data TX/RX function control from a single Python-based software interface. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer organic chip-carrier package and a 16-element phased-array TX IC or a 32-element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating 4 antennas that supports both normal and end-fire directions for a wide link spatial coverage.
Speaker(s): Xiaoxiong (Kevin) Gu,
Room: Level C
Bldg: New Residence Hall
3625 Av du Parc