An End-to-End Approach to the Challenges in Photonic Integrated Circuits (PIC) and Packaging
Room: MC603, 6th floor, Bldg: McConnell Engineering building, 3480 rue University, Montreal, Quebec, Canada, H3A 0C3, Virtual: https://events.vtools.ieee.org/m/472834Abstract : AIM Photonics, a Department of Defense (DoD) Manufacturing Innovation Institute (MII), offers end-to-end services in photonic integrated circuits (PICs), interposers, heterogeneous integration (HI), electronic photonic design automation (EPDA),... Read more