Abstract: Photonic integration has been at the center of photonic activity for several years. Over this period, great strides have been made to increase the integration density and integrated chip functionality. This talk will work its way up from the drivers for photonic integration – why do we need Photonic Integrated Circuits (PICs)? What are their similarities and differences with Electronic Integrated Circuits (EICs)? This analysis of integration drivers will lead to a discussion of recent progress on the main paths: monolithic, heterogeneous and hybrid. The talk will conclude with possible approaches to meet the additional demanding considerations for future Quantum PICs. Co-sponsored by: Co-sponsored by National Research Council, Canada. Optonique. Speaker(s): Daniel Renner Agenda: Please note the unusual time for the presentation. 14h-14h25 : free networking (in-person only) 14h25 -15h15 : technical presentation (hybrid) 15h15-15h30 : free networking (in-person only) Room: 1.246.01, Bldg: Cégep – bâtiment principal, 1111 Rue Lapierre, CEGEP André Laurendeau, LaSalle, Quebec, Canada, H8N 2J4, Virtual: https://events.vtools.ieee.org/m/413457