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Room: Level C, Bldg: New Residence Hall

October 2019

IEEE EMC Distinguished Lecturer: Opportunities, Challenges and Implementations of Silicon Integration and Packaging in mmWave Radar and Communication Applications

October 9, 2019 @ 1:30 pm - 2:45 pm EDT

Co-sponsored by: STARaCom Research Network Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus…

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